Semiconductor Packaging Market Size to Set USD 108.82 Bn by 2033

The global semiconductor packaging market size reached US$ 41.05 billion in 2023 and is projected to hit around US$ 108.82 billion by 2033, expanding at a CAGR of 10.24% during the forecast period from 2024 to 2033.

The rapid technology advancement has increased the launched of the smartphones which has risen the demand for the semiconductor packaging. The key players operating in the market are focused on adopting inorganic growth strategies like merger to develop advance technology for designing packaging films for semiconductor devices which is estimated to drive the global semiconductor packaging market over the forecast period.

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Semiconductor Packaging Market Key Takeaways

• Asia Pacific dominated the global semiconductor packaging market with the largest market share of 54% in 2023.
• North America is expected to grow at a significant rate in the market during the forecast period.
• By material type, the organic substrate segment has contributed more than 42% in 2023.
• By technology type, the traditional segment led the market with the largest share in 2023.
• By end user, the consumer electronics segment dominated the market in 2023.

Semiconductor Packaging Market Overview

A semiconductor is a material that can be used as the basis for computers and other electronic devices because of its unique electrical properties. Usually, it is a solid chemical element or compound that, in some situations, transmits electricity and, in others, does not. Due to this, it’s the perfect medium for managing electrical current in household equipment. The characteristics of semiconductor lie between those of an insulator and a conductor. Semiconductor are used to create transistors, integrated circuits (ICs), and diodes.

A variety of electronic solutions known as semiconductor packaging materials are used to connect integrated circuit chips (IC Chips) to printed circuit boards, other packages, or the package substrate. These materials are essential to 3D integration technologies, heterogeneous integration, and semiconductor wafer-level packaging methods. Electronics as a field has grown quickly in recent years, with integrated circuit (IC) technology leading the way. Smaller, lighter, and more powerful semiconductor devices are becoming the norm as 5G and 6G mobile technologies advance. For semiconductor chips to be physically protected, electrically connected, and to meet standard criteria, packaging is essential.

The packaging of semiconductors has advanced tremendously in modern times. A paper that was just published in Institute of Electrical and Electronics Engineers Transactions on Components, Packaging, and Manufacturing Technology covered the most current developments in semiconductor packaging. The landscape of semiconductor packaging comprises a number of integration strategies. With two or more chips on the same package substrate or fan-out redistribution layer (RDL) substrate, 2-D IC integration found in consumer goods like smartphones and smartwatches is called System-in-Package (SiP). Direct fabrication of fine metal layers on top of a build-up package substrate or high-density interconnect (HDI) is required for the 2.1-D IC integration.

Chips are supported by a passive through-silicon via (T5V) interposer in 2.5D IC integration, which is connected to package substrate by Advanced Micro Devices, Inc. company’s Radeon R9 Fury X GPU. The global packaging market size is estimated to grow from USD 1.20 trillion in 2022 to reach an estimated USD 1.58 trillion by 2032, growing at a 3.16% CAGR between 2023 and 2032.

Semiconductor Packaging Market Trends

• According to a survey, in 2024, sales of PC and smartphones are observed to grow by 4% globally.
• Nvidia’s overall semiconductor revenue grew by 56.4% In 2023.
• Another prominent survey report has predicted that automotive semiconductor revenue will reach $200 billion on annual basis by the mid-2030.

Growth Factors

• Emerging markets and trends for semiconductor packaging is expected to drive the growth of the global semiconductor packaging market over the forecast period.
• Increasing regulatory support is estimated to drive the growth of the market over the forecast period.
• Increasing focus on cost reduction and production efficiency can drive the specialty market growth further.
• Increasing in adoption of the advanced technology for the production of semiconductor packaging films is estimated to drive the growth of the global semiconductor packaging market in the near future.
• Increasing launch of the new policy by the government to support equipment monitoring and packaging solution is expected to drive the growth of the market over the forecast period.
• The key players operating in the market are focused on geographic expansion and launching their brand in other countries which is expected to drive the growth of the semiconductor packaging market in the near future.
• The increased investment, the rise in the market participants, and the presence of large market competitors in the market will contribute to the expansion of the semiconductor packaging market.

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