Key Trends and Findings
Panel-level packaging (PLP) is revolutionizing semiconductor packaging by shifting to large-panel configurations, offering the potential for significant cost savings through economies of scale and enhanced efficiency. The adoption of the SEMI Standard 3D20 in 2019 helped standardize panel sizes, enabling equipment manufacturers to develop tools that streamline the PLP process.
In the semiconductor industry, glass substrates are gaining traction due to their exceptional electrical properties and suitability for high-frequency applications. Companies with extensive experience in producing glass wafers and panels are well-positioned to capitalize on these trends as demand for glass-based solutions grows.
Technological advancements in areas such as 5G, the Internet of Things (IoT), virtual and augmented reality, and autonomous driving are driving an unprecedented demand for smaller, faster, and more capable electronic devices. Semiconductors, as a critical component in meeting these evolving demands, are becoming more essential to manufacturers who must innovate to comply with new regulatory requirements.
The latest advancements in integrated circuit packaging are enabling cutting-edge panel-level packaging techniques that protect vital components from the challenges of high-temperature manufacturing processes. As devices continue to shrink, the importance of effective thermal management is growing. Reducing thermal resistance is crucial, which depends on optimizing heat transfer paths, improving conductivity, and maximizing surface area for heat dissipation.
The Asia-Pacific region is set to experience the fastest growth, with a projected CAGR of 40.89% during the forecast period. This is driven by the rapid expansion of consumer electronics, IoT applications, and significant investments in semiconductor manufacturing.
In 2023, North America accounted for a substantial market share of 30.82%. This is attributed to the region’s advanced technological developments, high demand for cutting-edge electronics, and ongoing investments in R&D and innovation, particularly in industries such as automotive, aerospace, and consumer electronics.