Hermetic Packaging Market Size, Trends and Outlook for 2022-2032

The hermetic packaging market refers to the industry involved in creating and supplying hermetically sealed packages for various products. Hermetic packaging is a method of sealing electronic and optoelectronic components to protect them from external environmental factors such as moisture, gases, and other contaminants.

Report Highlights: Important Revelations

• Global hermetic packaging market size expected to reach USD 7.22 billion by 2032.
• Market was valued at USD 4.31 billion in 2022, growing at a CAGR of 5.3% (2023-2032).
• Hermetic packaging safeguarding high-reliability electronics in demanding environments.
• Asia Pacific takes the lead in the global hermetic packaging market by 42% market share.
• North America’s strategic role in shaping hermetic packaging market.
• Multilayer ceramic packages integrating hermetic sealing and advanced electrical enhancements.
• Passivation glass in maintaining hermetic package integrity.

Hermetic Packaging Safeguarding High-Reliability Electronics in Demanding Environments

The escalating demand for high-reliability electronics is evident in industries like oil and gas exploration (downhole drilling) and space exploration, where robust electronic systems are paramount. In these applications, hermetic packaging plays a pivotal role by delivering essential protection against severe environmental conditions. The hermetic sealing ensures the integrity and longevity of electronic components, meeting the stringent reliability requirements of industries operating in challenging and demanding environments. As a result, hermetic packaging serves as a crucial solution to safeguard electronic systems in high-stakes sectors where reliability is a top priority.

Hermetic Packaging Market Trends

Trends
Advancements in Materials and Technologies	Ongoing developments in materials and sealing technologies contribute to more efficient and reliable hermetic packaging. Innovations in sealants, encapsulation materials, and manufacturing processes aim to enhance performance and reduce costs.
Increased Miniaturization	The trend towards smaller and more compact electronic devices has driven the need for hermetic packaging solutions that can accommodate miniaturized components. This trend is particularly prominent in industries such as consumer electronics and medical devices.
Emerging Applications in 5G Technology	The deployment of 5G technology involves increased use of hermetic packaging to protect sensitive electronic components in telecommunications infrastructure. The higher frequencies and greater data transfer rates in 5G networks necessitate robust hermetic sealing to maintain optimal performance.
Focus on Sustainability	The industry has shown a trend toward environmentally sustainable practices. Manufacturers are exploring eco-friendly materials and production processes for hermetic packaging, aligning with broader corporate and industry-wide sustainability initiatives.

Asia Pacific Takes the Lead in the Global Hermetic Packaging Market

Asia Pacific region has emerged as a frontrunner in the global hermetic packaging market, showcasing robust growth and a commanding market share. This leadership position can be attributed to several key factors that reflect the region’s dynamism and influence in the electronics and manufacturing sectors.

Asia Pacific Dominance:

• Manufacturing powerhouse with major electronics producers like China, Japan, South Korea, and Taiwan.
• Boasts advanced manufacturing capabilities, leading in semiconductor and electronic component production.
• Growing demand for hermetic packaging due to extensive electronic device production in industries such as consumer electronics, telecommunications, and automotive.
• Significant investments in infrastructure development, including telecommunications and aerospace projects, further drive the need for high-reliability hermetic packaging.

North America’s Position:

• Second-largest region with a strong market presence.
• Thriving technology sector, especially in the United States.
• Demand driven by the critical need to protect electronic components in diverse applications.
• Dominance in aerospace and defense industries contributes to the adoption of hermetic packaging solutions.
• Commitment to research and development fosters continuous innovation in hermetic sealing technologies.

Multilayer Ceramic Packages:

• Meticulous process involving metallization, lamination, and firing of ceramic tape layers.
• Leads brazed onto the package body, electroplating for electrical performance, and soldering a metal lid for airtight seal.
• Versatile construction allows integration of various electrical enhancements for advanced electronic solutions.

Surging Demand in the Defence Sector:

• Increasing utilization of hermetic packaging in critical defense applications.
• Essential for packaging and transporting military equipment securely.
• Expanding use of hermetic packaging expected to benefit companies in the market.

Passivation Glass in Hermetic Packaging:

• Ensures longevity and reliability of electronic components by creating a protective barrier.
• Glass layer acts as a durable and inert shield against moisture, gases, corrosion, and oxidation.
• Compatible with various sealing methods and widely adopted in aerospace, defense, and medical applications.

Competitive Landscape:

• Key players include Schott AG, Willow Technologies, AMETEK Inc., Amkor Technology, Materion Corporation, and others.
• Strategies include mergers, acquisitions, product innovations, and regional expansion.
• Market influenced by changes in regulatory requirements and shifts in consumer preferences.

Recent Developments:

• Macross expands its packaging and substrate capabilities through the acquisition of Technograph Microcircuits Ltd.
• Electronic Products, Inc. acquired by Douglas Electrical Component, a producer of hermetic interconnects.
• QnnectTM, part of Arcline Investment Management, acquires Hermetic Solutions Group to enhance its range of specialty interconnect solutions.
• Cristek Interconnects, Inc., acquired by Hermetic Solutions Group, a global supplier of protection solutions for mission-critical microelectronics.

Market Segments:

Configuration:

• Multilayer Ceramic Packages
• Pressed Ceramic Packages
• Metal Can Packages

Type:

• Passivation Glass
• Transponder Glass
• Reed Glass

Regions:

• North America
• Europe
• Asia Pacific
• LAMEA